LTCC as substrate - Enabling semiconductor and packaging integration
- Bartsch, H.
- Pezoldt, J.
- Sanchez, F.M.M.
- Rios, J.J.J.
- Delgado, J.M.M.
- Breiling, J.
- Muller, J.
Actes:
2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
ISBN: 9780956808660
Any de publicació: 2019
Tipus: Aportació congrés